Leaf Morphology and Pollen Viability of Blackgram [Vigna Mungo (L.) Hepper] Genotypes Under Heat Stress Conditiona

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C. HARITHA*, P. SANDHYA RANI, P. LATHA AND S. HEMALATHA

Department of Crop Physiology, S.V. Agricultural College, ANGRAU, Tirupati.

ABSTRACT

Laboratory experiment was conducted to screen fifty blackgram genotypes for high temperature tolerance using Temperature Induction Response (TIR) technique with nine tolerant blackgram genotypes viz., LBG 977, PU 1504, LBG 982, LBG 977, ABF 04, LBG 973, NRISRI, TBG 129, LBG 888 and one susceptible genotype TBG 125 were selected based on TIR for further screening them for high temperature stress tolerance under field condition. Sowings were carried in such a way that flowering of the genotypes coincided with the high temperatures. A wide variation was observed among the genotypes in their leaf characters such as leaf thickness, leaf pubescence, cuticle thickness and pollen viability percentage. The genotypes LBG 888 and TBG 129 were found to have higher leaf thickness, pubescence and pollen viability percentage, which denote their heat tolerance and ability to withstand higher temperature. Whereas, the susceptible genotype TBG 125 recorded lower values for leaf thickness pubescence and pollen viability percentage.

KEYWORDS:

Blackgram, Leaf thickness, Leaf pubescence, Pollen viability.

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